Lowongan Senior Staff Engineer Wirebond R&D di PT Infineon Technologies Batam

As an R&D Engineer, you will develop new processes and ensure design to cost & design to manufacturing, actively challenging current processes and looking for improvement, efficiencies, and value engineering.

In your new role you will:

• Perform Wire Bonding process characterization and define the workable process window.
• Process enabler for new package development, ramp, platform extension, and innovation.
• Identify problems or deviations, recommend and implement corrective actions.
• Define and characterize new process/equipment/tooling and road map activities.
• Derive and define new process design guidelines for new package technologies.
• Conduct process knowledge transfer and end-to-end collaboration with the operation.

You are best equipped for this task if you have:

• Bachelor's degree in engineering (electrical/electronic, mechanical, materials, or another relevant course).
• Minimum 10 years of working experience in the Wire Bonding process with hands-on ability.
• Good interpersonal skills, proactive, and high teamwork spirit of collaborating with cross sites counterparts.
• Good analytical and problem-solving skills.
• Required to travel overseas for work when needed

Part of your life. Part of tomorrow.

Infineon is a world leader in semiconductor solutions that make life easier, safer, and greener. Our solutions for efficient energy management, smart mobility, and secure, seamless communications link the real and the digital world.